JPS6228762Y2 - - Google Patents
Info
- Publication number
- JPS6228762Y2 JPS6228762Y2 JP18237581U JP18237581U JPS6228762Y2 JP S6228762 Y2 JPS6228762 Y2 JP S6228762Y2 JP 18237581 U JP18237581 U JP 18237581U JP 18237581 U JP18237581 U JP 18237581U JP S6228762 Y2 JPS6228762 Y2 JP S6228762Y2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- resin base
- integrated circuit
- time
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011888 foil Substances 0.000 claims description 10
- 238000001879 gelation Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18237581U JPS5887350U (ja) | 1981-12-07 | 1981-12-07 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18237581U JPS5887350U (ja) | 1981-12-07 | 1981-12-07 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5887350U JPS5887350U (ja) | 1983-06-14 |
| JPS6228762Y2 true JPS6228762Y2 (en]) | 1987-07-23 |
Family
ID=29980687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18237581U Granted JPS5887350U (ja) | 1981-12-07 | 1981-12-07 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5887350U (en]) |
-
1981
- 1981-12-07 JP JP18237581U patent/JPS5887350U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5887350U (ja) | 1983-06-14 |
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